Solder Jet Printing for complex PCB assembly:
#Xscope printing corporation full
This X-Ray system provides a full 350° coverage for inspection, using a powerful 160kV tube to observe a wide range of objects. The system can accept large format PCBAs, up to 580mm x 580mm. Our X-Tek X-Ray system supports our production engineers with fast validation as part of the first off reporting process.
#Xscope printing corporation serial number
Output reports can be created and traced by serial number and supplied as standard within FAIR reports. Automated programs are created and executed to scan each PCBA to ensure every target device is checked and validated, removing human error and subjective opinion. The system uses a powerful 130kV tube, with ±50° and can accept large format products up to 575mm X 450mm.īespoke reporting is available for each PCBA providing fully documented evidence of target components. The X-Scope has many features which improve efficiency such as detection at 5µ to cover a wide range of components beyond ♛GA, QFN's and leadless devices including over moulded components, semiconductors and the accurate analysis of barrel fill of PTH components. Our Scienscope X-Scope 3000 X-Ray system has feature rich tools for advanced defect detection including automatic void detection. Convection soldering with or without nitrogen (N2).Vapour phase & vacuum vapour phase reflow soldering.Controlled paste application with solder jet printing.Package on package BGA assembly, BGA assembly, BGA repair & re-work.3D AOI, automated optical inspection from Mirtec.ERSA IR650 Re-work platform, infrared process with large format capability.Scienscope X-Scope 3000 with 130kV & automated inspection procedures.X-Tek XT100 X-Ray system with full pan/tilt 350°.Our experienced IPC trained engineers have a full range of tools available. To support this capability we have a robust and documented quality audit process that checks the quality of the product at each stage of manufacture. We use two different X-Ray inspection platforms to examine and measure every aspect of our customers products for conformance.
High technology components have 'small process windows', where the control of the solder paste application and reflow is critical for conformance. Our capability allows us to work the latest array of component technology available. Since the early 1990's, we have been working with technically challenging surface mount products and complex SMT devices, we have a comprehensive range of equipment to ensure product conformance. Complex SMT Devices BGA, PoP, CSP, QFN, DFNĪs a fully inclusive CEM service provider, we enjoy an enviable reputation for delivering the highest levels of production value and service.
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